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Microvias : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee.

By: Contributor(s): Material type: TextTextPublication details: New York : McGraw-Hill, c2001.Description: xxiii, 565 p. : ill., figs., tables ; 24 cmISBN:
  • 0071363270
Subject(s): DDC classification:
  • 621.381046/ L366m 22
LOC classification:
  • TK7874 .L31684 2001
Online resources:
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Holdings
Item type Current library Collection Call number Copy number Status Date due Barcode Item holds
Book Book Daffodil International University Library General Stacks Non-fiction 621.381046/ L366m (Browse shelf(Opens below)) 1 Available 003718
Total holds: 0

Includes bibliographical references [p. 541-547] and index.

CSE, ETE, EEE

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