Lau, John H. <br/><br/>
Microvias :  for low cost, high density interconnects / 
John H. Lau, S.W. Ricky Lee. 
 - New York :  McGraw-Hill,  c2001. 
 - xxiii, 565 p. :  ill., figs., tables ;  24 cm. 
<br/><br/>Includes bibliographical references [p. 541-547] and index. 
<br/><br/>
<br/><br/><label>ISBN: </label>0071363270 
<br/><br/><label>LCCN: </label>2001030752 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging.<br/>Integrated circuits--Design and construction--Cost control.<br/>Semiconductors--Junctions.<br/>Printed circuits.
<br/><br/><label>LC Class. No.: </label>TK7874  / .L31684 2001 
<br/><br/><label>Dewey Class. No.: </label>621.381046/ L366m